Nvidia’s use of TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging for its new Blackwell platform merchandise has led to the Taiwanese producer ramping up its manufacturing capability for 2024. Nvidia’s newest Blackwell platform merchandise embody the brand new B200 GPU (Graphics Processing Unit) and the GB200, which integrates the Grace CPU (Central Processing Unit), and all use high-precision CoWoS packaging from TSMC. CoWoS packaging is a know-how that integrates a number of chips on a single substrate to enhance efficiency and effectivity in semiconductor units. The GB200 is anticipated to ship multiple million models in 2025, representing round 40% to 50% of Nvidia’s high-end GPU shipments, in line with provide chain sources. TSMC is at present growing its CoWoS manufacturing capability, with estimated month-to-month capability anticipated to close 40,000 models by the tip of the 12 months, a rise of over 150% in comparison with 2023. [Icsmart, in Chinese]
